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PCT High Pressure Accelerated Aging Test Mahcine for Semi Conductor Reliability Testing
Product description
The purpose of the Highly Accelerated Aging Test (HAST) is to increase product environmental stress (such as temperature) and working stress (voltage, load, etc. applied to the product), speed up the test process, and shorten the life test time of the product or system. , The reliability of semiconductor products has improved. At present, most electronic devices can withstand long-term high temperature and high humidity deviation tests without failure. Therefore, the test time used to determine the quality of the finished product has also increased a lot. In the design stage of the product, it is used to quickly expose the defects and weaknesses of the product, and test the sealing and aging performance of its products.
Volume and dimension
| Volume | About 55L |
| Interior size | Ø550 mm*D650mm(Drum type pressure inner box) |
| Exterior size | W900 mm*H1552mm*D1500 mm(Excluding the protruding part of the machine!) Tips: For external dimensions, please confirm the three views according to the final design! |
The main technical parameters
| Test Conditions | Cool method: :Natural cooling or air purging Measured at a room temperature of +25 ºC under no load, Measured at normal pressure 101.3Kpa, the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit. |
| Temperature range | +105ºC~+135ºC(At 100% relative humidity) |
| Temp. fluctuation | ±0.5ºC |
| Temp. uniformity | ≤±3.0ºC |
| Temp. deviation | ≤±3.0ºC |
| Humidity range | 1) HUM unsaturated test mode: 65~100%RH 2) STD saturation test mode: 100%RH |
| Humidity Fluctuation | ±3.0%RH |
| Humidity Deviation | ±5.0%RH |
| Temperature change rate | Heat up rate: +25ºC~+135ºC, full range average speed approx 45 min (no-load,no heating) |
| Load | no |
| Note:Measured at a room temperature of +25 ºC under no load,the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit. | |
| Pressure range | Gauge pressure: +0.2 ~ 200Kpa *Absolute pressure: 100 ~ 300Kpa |
| Pressure deviation | ≤±2 kPa |
| Pressure rise time | Atmospheric pressure to 200Kpa 20min |
Features:
The industry's first application of fluid simulation design technology and product process manufacturing technology, the product is more energy-efficient.
The inner tank adopts a double-layer arc design, which can prevent the phenomenon of condensation and dripping in the test, so as to avoid the direct impact of the superheated steam on the product in the test process and affect the test result.
Fully automatic water replenishment function, front-mounted water level confirmation.
(Attached table)
| Test conditions | Temperature | Humidity | Duration | Remark |
| JEDE-22-A102 | 121ºC | 100%R.H. | 168h | Other duration: 24h, 48h, 96h, 168h, 240h, 336h |
| IPC-FC-241B-PCB tensile strength test of copper laminate | 121ºC | 100%R.H. | 100h | Copper laminate strength: 1000N/m |
| IC auto clave testing | 121ºC | 100%R.H. | 288h | |
| Low dielectric high heat resistance multilayer board | 121ºC | 100%R.H. | 192h | |
| PCB plugging agent | 121ºC | 100%R.H. | 192h | |
| PCB-PCT test | 121ºC | 100%R.H. | 30min | Lamination, bubble, white dot |
| Lead free soldering accelerated aging test 1 | 121ºC | 100%R.H. | 8h | Equivalent to 6 months high temp high humidity, activation energy: 4.44ev |
| Lead free soldering accelerated aging test 2 | 121ºC | 100%R.H. | 16h | Equivalent to 12 months high temp high humidity, activation energy: 4.44ev |
| IC lead free aging test | 121ºC | 100%R.H. | 1000h | Check at every 500h |
| Flat panel tightness test | 121ºC | 100%R.H. | 12h | |
| Metallic gasket | 121ºC | 100%R.H. | 24h | |
| IC packaging test | 121ºC | 100%R.H. | 500h, 1000h | |
| PCB moisture absorb test | 121ºC | 100%R.H. | 5h, 8h | |
| FPC moisture absorb test | 121ºC | 100%R.H. | 192h | |
| PCB plugging agent | 121ºC | 100%R.H. | 192h | |
| Low dielectric high heat resistance multilayer material | 121ºC | 100%R.H. | 5h | Water absorption less than 0.4-0.6% |
| High Tg glass epoxy multilayer PCB material | 121ºC | 100%R.H. | 5h | Water absorption less than 0.55-0.65% |
| High Tg glass epoxy multilayer PCB material Heat resistance of reflow welding after moisture absorption |
121ºC | 100%R.H. | 3h | |
| Co-bra Bond | 121ºC | 100%R.H. | 168h | |
| Automotive PCB | 121ºC | 100%R.H. | 50h, 100h | |
| Mainboard PCB | 121ºC | 100%R.H. | 30min | |
| GBA board | 121ºC | 100%R.H. | 24h | |
| IC accelerated moisture resistance test | 121ºC | 100%R.H. | 8h |
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